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Reliable socket solutions for your test and burn-in challenges.
Plastronics offers an extensive catalog of finished sockets that are ready to fulfill burn-in, humidity, failure analysis, and test requirements for the latest packaged devices, including QFN, LGA, BGA and μBGA. We control the entire process to give customers a high-quality, cost-effective socket solution with a quick turnaround.
- Higher Currents
- Higher Frequency
- Larger packages with pin counts up to 3000 I/Os that are have .25mm+ in warpage
- Packages down to .4mm pitch between pads or balls
Whether your package matches perfectly with a socket in our current catalog, or you need a custom product for your innovation, Plastronics has the technology and the expertise to determine and deliver the right solution for you.